A compact and electrically grounded enclosure facilitates locating a board stack assembly camera inside and can be rated IP67 or higher. The enclosure has connectors integrated ended in the back bezel of the enclosure and a front lens mount that allows for the direct assembly of interchangeable lens covers. The purpose of the enclosure is to take an existing board stack and locate it within the enclosure thereby forming a camera assembly. The enclosure and its packaging have improved interchangeability of the lens covers and back pieces, as well as heat transfer. Methods for assembling and mounting the board stack within the enclosure and securing the enclosure are also disclosed.