Abstract
A composite substrate includes a resin substrate and a low-temperature fired ceramic bonded to the resin substrate in a thickness direction. The low-temperature fired ceramic is a substantially rectangular cuboid having a first main face, a second main face opposing the first main face, and side faces connecting the first main face and the second main face. The first main face is directly bonded to the resin substrate. Corners between the first main face and the side faces are rounded with a radius R1. Corners between adjacent side faces are rounded with a radius R2. The radius R2 is greater than the radius R1.
Full Text
What is claimed is:
A composite substrate includes a resin substrate and a low-temperature fired ceramic bonded to the resin substrate in a thickness direction. The low-temperature fired ceramic is a substantially rectangular cuboid having a first main face, a second main face opposing the first main face, and side faces connecting the first main face and the second main face. The first main face is directly bonded to the resin substrate. Corners between the first main face and the side faces are rounded with a radius R1. Corners between adjacent side faces are rounded with a radius R2. The radius R2 is greater than the radius R1.
Timeline
Filed
02/20/2026Published
06/25/2026Granted
Not AvailableIPC Codes(4)
H05K 1/03:Use of materials for the substrate
C04B 35/64:Burning or sintering processes (takes precedence C04B 33/32)
H05K 1/16:incorporating printed electric components, e.g. printed resistors, capacitors or inductors