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/Semiconductor Element
Abstract

A semiconductor element includes a semiconductor substrate having: an IGBT region that overlaps with a collector region; and a diode region that overlaps with a cathode region. Inter-trench semiconductor regions include a hole injection restriction structure having: an n-type barrier region in contact with a body region from below; and a pillar region that extends from the barrier region to an emitter electrode and in Schottky contact with the emitter electrode. The IGBT region has a boundary region formed by the inter-trench semiconductor regions located between a main region and the diode region. The hole injection restriction structure is provided in the inter-trench semiconductor regions within the diode region and the boundary region.

Full Text

What is claimed is:

A semiconductor element includes a semiconductor substrate having: an IGBT region that overlaps with a collector region; and a diode region that overlaps with a cathode region. Inter-trench semiconductor regions include a hole injection restriction structure having: an n-type barrier region in contact with a body region from below; and a pillar region that extends from the barrier region to an emitter electrode and in Schottky contact with the emitter electrode. The IGBT region has a boundary region formed by the inter-trench semiconductor regions located between a main region and the diode region. The hole injection restriction structure is provided in the inter-trench semiconductor regions within the diode region and the boundary region.
Timeline
Filed
02/19/2026
Published
06/25/2026
Granted
Not Available
IPC Codes(2)
H10D 84/00:Integrated devices formed in or on semiconductor substrates that comprise only semiconducting layers, e.g. on Si wafers or on GaAs-on-Si wafers
H10D 12/00:Bipolar devices controlled by the field effect, e.g. insulated-gate bipolar transistors [IGBT]