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/Integrated Wet Clean For Gate Stack Development
Abstract

Exemplary integrated cluster tools may include a factory interface including a first transfer robot. The tools may include a wet clean system coupled with the factory interface at a first side of the wet clean system. The tools may include a load lock chamber coupled with the wet clean system at a second side of the wet clean system opposite the first side of the wet clean system. The tools may include a first transfer chamber coupled with the load lock chamber. The first transfer chamber may include a second transfer robot. The tools may include a thermal treatment chamber coupled with the first transfer chamber. The tools may include a second transfer chamber coupled with the first transfer chamber. The second transfer chamber May include a third transfer robot. The tools may include a metal deposition chamber coupled with the second transfer chamber.

Full Text

What is claimed is:

Exemplary integrated cluster tools may include a factory interface including a first transfer robot. The tools may include a wet clean system coupled with the factory interface at a first side of the wet clean system. The tools may include a load lock chamber coupled with the wet clean system at a second side of the wet clean system opposite the first side of the wet clean system. The tools may include a first transfer chamber coupled with the load lock chamber. The first transfer chamber may include a second transfer robot. The tools may include a thermal treatment chamber coupled with the first transfer chamber. The tools may include a second transfer chamber coupled with the first transfer chamber. The second transfer chamber May include a third transfer robot. The tools may include a metal deposition chamber coupled with the second transfer chamber.
Timeline
Filed
02/20/2026
Published
06/25/2026
Granted
Not Available
IPC Codes(4)
H10P 70/00:Cleaning of wafers, substrates or parts of devices
H10D 64/01:Manufacture or treatment
H10P 72/00:Handling or holding of wafers, substrates or devices during manufacture or treatment thereof