An inverter and a heat apparatus are disclosed including a circuit board, a power module, and a heat apparatus. The heat apparatus includes an evaporator, a condenser, and a cooling medium. The evaporator is in heat-conducting connection to the power module. The evaporator has an evaporation chamber, the condenser has a condensation channel and an air flow channel, the condensation channel has a first end opening and a second end opening that face away from each other, a gas discharge opening communicates with the first end opening, a liquid return opening communicates with the second end opening, and the condensation channel is parallel to the air flow channel.