A package includes a first leadframe including a plurality of leads and a conductor, a first semiconductor die mounted on a first surface of the first leadframe and attached to a first subset of the plurality of leads and the conductor, and a second semiconductor die mounted on the first surface of the first leadframe and attached a second subset of the plurality of leads and the conductor. The conductor provides a direct electrical connection for an electrical signal between the first semiconductor die and the second semiconductor die. The package further includes a second leadframe. The first leadframe is mounted on the second leadframe via a second surface of the first leadframe, the second surface opposite the first surface. The second leadframe provides a ground return path between the first semiconductor die and the second semiconductor die for the electrical signal.