Abstract
A polishing composition includes at least one abrasive, at least one organic acid, at least one anionic surfactant comprising at least a phosphate, at least one phosphonic acid compound having a molecular weight below 500 g/mol, at least one azole containing compound, at least one alkylamine compound having a 6-24 carbon alkyl chain, and an aqueous solvent, and optionally, a pH adjuster.
Full Text
What is claimed is:
A polishing composition includes at least one abrasive, at least one organic acid, at least one anionic surfactant comprising at least a phosphate, at least one phosphonic acid compound having a molecular weight below 500 g/mol, at least one azole containing compound, at least one alkylamine compound having a 6-24 carbon alkyl chain, and an aqueous solvent, and optionally, a pH adjuster.
Timeline
Filed
02/27/2026Published
07/02/2026Granted
Not AvailableIPC Codes(2)
C09G 1/02:containing abrasives or grinding agents
H10P 52/40:Chemomechanical polishing [CMP] (electrochemical mechanical polishing H10P 52/20)