A printed substrate, preferably for the production of paper-based packaging, with a carrier layer including at least one paper layer. On a first side of the carrier layer a first transfer-metallized metal layer is provided which is connected to the carrier layer via at least one adhesive layer and preferably at least one lacquer layer. The first metal layer optionally has at least one coating with a release lacquer on the side opposite the carrier layer. The carrier layer on the first transfer-metallized metal layer and/or on the optional coating with a release lacquer provided at least in some areas on the first transfer-metallized metal layer, is printed with at least one electron beam-curable printing ink at least in some areas. The at least one, at least in some areas provided, electron beam-curable coating with an overprint varnish is provided on the printed side of the carrier layer.