beta
/Power Assembly With Liquid Cooling Radiator, Motor Control Unit, Powertrain, And Vehicle
Abstract

A power assembly with a liquid cooling radiator, a motor control unit, a powertrain, and a vehicle. The power assembly includes a substrate, the liquid cooling radiator, and a sealing member. The substrate is configured to fasten a power switching transistor. The liquid cooling radiator includes a groove structure. The groove structure includes a bottom plate and a side plate, and the bottom plate and the substrate are spaced apart in a thickness direction of the substrate. The sealing member is configured to fasten a peripheral side surface of the substrate and an end face that is of the side plate and that faces away from the bottom plate. A material of the sealing member is different from that of the substrate. The side plate and the substrate are connected through the sealing member, so that connection stability between the substrate and the side plate is improved.

Full Text

What is claimed is:

A power assembly with a liquid cooling radiator, a motor control unit, a powertrain, and a vehicle. The power assembly includes a substrate, the liquid cooling radiator, and a sealing member. The substrate is configured to fasten a power switching transistor. The liquid cooling radiator includes a groove structure. The groove structure includes a bottom plate and a side plate, and the bottom plate and the substrate are spaced apart in a thickness direction of the substrate. The sealing member is configured to fasten a peripheral side surface of the substrate and an end face that is of the side plate and that faces away from the bottom plate. A material of the sealing member is different from that of the substrate. The side plate and the substrate are connected through the sealing member, so that connection stability between the substrate and the side plate is improved.
Timeline
Filed
02/27/2026
Published
07/02/2026
Granted
Not Available
IPC Codes(4)
H10W 40/47:by flowing liquids, e.g. forced water cooling
H02K 11/33:Drive circuits, e.g. power electronics (takes precedence H02K 11/38)
H10W 40/20:Arrangements for cooling