Abstract
A smart speaker includes an outer casing, a speaker module, and a microphone module is provided. The outer casing includes a first housing and a second housing assembled to each other. The speaker module is disposed in the first housing. The microphone module includes a circuit board and at least one microphone. The circuit board is assembled to the second housing and separated from the first housing. The microphone is disposed on the circuit board.
Full Text
What is claimed is:
A smart speaker includes an outer casing, a speaker module, and a microphone module is provided. The outer casing includes a first housing and a second housing assembled to each other. The speaker module is disposed in the first housing. The microphone module includes a circuit board and at least one microphone. The circuit board is assembled to the second housing and separated from the first housing. The microphone is disposed on the circuit board.
Timeline
Filed
02/26/2026Published
07/02/2026Granted
Not AvailableIPC Codes(4)
H04R 1/04:Structural association of microphone with electric circuitry therefor (in electric hearing aids H04R 25/00)
H04R 1/08:Mouthpieces; Attachments therefor
H04R 1/28:Transducer mountings or enclosures designed for specific frequency response; Transducer enclosures modified by provision of mechanical or acoustic impedances, e.g. resonator, damping means