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/Semiconductor Devices And Methods Of Manufacturing Thereof
Abstract

A semiconductor device includes a semiconductor channel. The semiconductor device includes a metal gate structure disposed over the semiconductor channel. The semiconductor device includes a gate electrode having a bottom surface contacting an upper surface of the metal gate structure. The gate electrode has its side portions extending from its top surface toward the semiconductor fin with a first depth and a central portion extending from its top surface toward the semiconductor fin with a second depth, the first depth being substantially greater than the second depth.

Full Text

What is claimed is:

A semiconductor device includes a semiconductor channel. The semiconductor device includes a metal gate structure disposed over the semiconductor channel. The semiconductor device includes a gate electrode having a bottom surface contacting an upper surface of the metal gate structure. The gate electrode has its side portions extending from its top surface toward the semiconductor fin with a first depth and a central portion extending from its top surface toward the semiconductor fin with a second depth, the first depth being substantially greater than the second depth.
Timeline
Filed
02/27/2026
Published
07/02/2026
Granted
Not Available
IPC Codes(6)
H10D 30/01:Manufacture or treatment
H10D 30/62:Fin field-effect transistors [FinFET]
H10D 64/01:Manufacture or treatment