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/Apparatus And Method For Forming And Releasing Substrate Stack From Carrier
Abstract

An apparatus for releasing a substrate stack includes: a carrier configured to support the substrate stack; a fixture disposed on the carrier and configured to surround the substrate stack; first pins attached to the fixture and extending perpendicular to a top surface of the fixture; and a torque rod positioned between the first pins and configured to engage the first pins to apply torque on the fixture relative to the carrier to release the substrate stack from the carrier.

Full Text

What is claimed is:

An apparatus for releasing a substrate stack includes: a carrier configured to support the substrate stack; a fixture disposed on the carrier and configured to surround the substrate stack; first pins attached to the fixture and extending perpendicular to a top surface of the fixture; and a torque rod positioned between the first pins and configured to engage the first pins to apply torque on the fixture relative to the carrier to release the substrate stack from the carrier.
Timeline
Filed
02/25/2026
Published
07/02/2026
Granted
Not Available
IPC Codes(7)
H10P 72/70:for supporting or gripping
H10W 70/685:comprising multiple insulating layers
H10W 72/00:Interconnections or connectors in packages