An electronic package is provided. The electronic package comprises an electronic component, a substrate, at least one ground plane enclosed in or supported by the substrate, at least one electronic component mounted to the substrate, the at least one electronic component including at least one non-groundable thermal output, at least one thermally conductive pathway extending within the substrate between an interface exposed on the substrate and the at least one ground plane, the at least one thermally conductive pathway configured to electrically isolate the interface from the at least one ground plane, and at least one thermally conductive member coupling the at least one non-groundable thermal output to the interface, a first end of the at least one thermally conductive member being soldered to the at least one electronic component and a second end of the at least one thermally conductive member being in non-bonded surface contact with the interface.