beta
/Substrate Processing Apparatus And Substrate Processing System
Abstract

A substrate processing apparatus configured to process a substrate, the substrate processing apparatus including: a processing chamber; and a support structure located in the processing chamber and having a tray supporting surface for supporting a tray on an upper surface of the support structure, wherein the tray is formed with a recess accommodating the substrate on an upper surface of the tray, the support structure includes a lift pin to lift and lower the tray at an upper portion of the support structure, the support structure has a through-hole into which the lift pin is inserted, and the through-hole is at a position where the through-hole does not overlap with the tray in plan view when the tray is located on the support structure.

Full Text

What is claimed is:

A substrate processing apparatus configured to process a substrate, the substrate processing apparatus including: a processing chamber; and a support structure located in the processing chamber and having a tray supporting surface for supporting a tray on an upper surface of the support structure, wherein the tray is formed with a recess accommodating the substrate on an upper surface of the tray, the support structure includes a lift pin to lift and lower the tray at an upper portion of the support structure, the support structure has a through-hole into which the lift pin is inserted, and the through-hole is at a position where the through-hole does not overlap with the tray in plan view when the tray is located on the support structure.
Timeline
Filed
02/27/2026
Published
07/02/2026
Granted
Not Available
IPC Codes(2)
H10P 72/76:using mechanical means, e.g. clamps or pinches
H10P 72/72:using electrostatic chucks