Abstract
A method includes dispensing sacrificial region over a carrier, and forming a metal post over the carrier. The metal post overlaps at least a portion of the sacrificial region. The method further includes encapsulating the metal post and the sacrificial region in an encapsulating material, demounting the metal post, the sacrificial region, and the encapsulating material from the carrier, and removing at least a portion of the sacrificial region to form a recess extending from a surface level of the encapsulating material into the encapsulating material.
Full Text
What is claimed is:
A method includes dispensing sacrificial region over a carrier, and forming a metal post over the carrier. The metal post overlaps at least a portion of the sacrificial region. The method further includes encapsulating the metal post and the sacrificial region in an encapsulating material, demounting the metal post, the sacrificial region, and the encapsulating material from the carrier, and removing at least a portion of the sacrificial region to form a recess extending from a surface level of the encapsulating material into the encapsulating material.
Timeline
Filed
02/27/2026Published
07/02/2026Granted
Not AvailableIPC Codes(12)
H10W 70/60:Insulating or insulated package substrates; Interposers; Redistribution layers (leadframes H10W 70/40)
H10P 72/70:for supporting or gripping
H10W 70/05:of insulating or insulated package substrates, or of interposers, or of redistribution layers (manufacture or treatment of leadframes H10W 70/04)