The semiconductor package structure includes: a substrate, and a first chip and a second chip that are stacked on the substrate, where the first chip is located between the substrate and the second chip; a filling part, surrounding a side face of the first chip and a side face of the second chip, and being continuous in a direction perpendicular to the substrate; and a support ring, where an orthographic projection of the support ring on the substrate surrounds an orthographic projection of the first chip on the substrate, the support ring is embedded in the filling part, and is located on a side that is of a first reference plane and that is close to the substrate, and the first reference plane is a plane on which a surface that is of the second chip and that is close to the first chip is located.