Abstract
The present invention relates to a condensing panel assembly and a heat dissipation device including same, and, particularly, the heat dissipation device comprises an evaporation panel assembly in which a reservoir storing a refrigerant capable of phase change according to temperature is formed and at least a portion of a lower surface thereof is in surface thermal contact with heat-generating surfaces of heating elements; and a plurality of condensing panel assemblies coupled to the evaporation panel assembly to communicate with the reservoir and configured to release heat transferred from the heating elements through heat exchange with outside air (outdoor air).
Full Text
What is claimed is:
The present invention relates to a condensing panel assembly and a heat dissipation device including same, and, particularly, the heat dissipation device comprises an evaporation panel assembly in which a reservoir storing a refrigerant capable of phase change according to temperature is formed and at least a portion of a lower surface thereof is in surface thermal contact with heat-generating surfaces of heating elements; and a plurality of condensing panel assemblies coupled to the evaporation panel assembly to communicate with the reservoir and configured to release heat transferred from the heating elements through heat exchange with outside air (outdoor air).
Timeline
Filed
02/25/2026Published
07/02/2026Granted
Not AvailableIPC Codes(2)
F28F 3/04:the means being integral with the element
F28D 21/00:Heat-exchange apparatus not covered by any of the groups