An electronic device disclosed in the disclosure may include a housing, a first electronic component disposed in a first area of an interior of the housing, a second electronic component disposed in a second area being different from the first area of the interior of the housing, and a heat diffusion member disposed in a heat dissipation area formed from the first area to the second area, and including a first part corresponding to the first area, a second part corresponding to the second area, and a connecting part connecting the first part and the second part, and the heat diffusion member includes at least one recess. In addition, various embodiments identified through the specification are possible.