Abstract
In one aspect, a power module includes: a base plate; a power module body, where the power module body includes a plurality of semiconductor devices constituting an OBC-DC circuit, and the power module body is disposed on a first side surface of the base plate; and a package housing, where the package housing packages the power module body on the first side surface of the base plate.
Full Text
What is claimed is:
In one aspect, a power module includes: a base plate; a power module body, where the power module body includes a plurality of semiconductor devices constituting an OBC-DC circuit, and the power module body is disposed on a first side surface of the base plate; and a package housing, where the package housing packages the power module body on the first side surface of the base plate.
Timeline
Filed
03/05/2026Published
07/09/2026Granted
Not AvailableIPC Codes(7)
H10W 90/00:Package configurations
B60R 16/033:characterised by the use of electrical cells or batteries
H02M 3/00:Conversion of DC power input into DC power output