/Semiconductor Package Including Stacked Semiconductor Devices And Method Of Manufacturing The Semiconductor Package
Abstract
A semiconductor package includes a first package substrate. A first semiconductor device is mounted on an upper surface of the first package substrate. A first molding is disposed on the first package substrate and covers the first semiconductor device. A second package substrate is disposed on the first molding. At least one second semiconductor device is mounted on an upper surface of the second package substrate. A second molding covers the second semiconductor device. The second molding has a marking pattern in the first region. The second molding has an uneven structure having a plurality of trenches that define a plurality of column structures protruding from a second region on the second semiconductor device.
Full Text
What is claimed is:
A semiconductor package includes a first package substrate. A first semiconductor device is mounted on an upper surface of the first package substrate. A first molding is disposed on the first package substrate and covers the first semiconductor device. A second package substrate is disposed on the first molding. At least one second semiconductor device is mounted on an upper surface of the second package substrate. A second molding covers the second semiconductor device. The second molding has a marking pattern in the first region. The second molding has an uneven structure having a plurality of trenches that define a plurality of column structures protruding from a second region on the second semiconductor device.
Timeline
Filed
03/06/2026Published
07/09/2026Granted
Not AvailableIPC Codes(11)
H10W 70/685:comprising multiple insulating layers
H10W 46/00:Marks applied to devices, e.g. for alignment or identification
H10W 70/60:Insulating or insulated package substrates; Interposers; Redistribution layers (leadframes H10W 70/40)