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/Actinic Ray-sensitive Or Radiation-sensitive Resin Composition, Actinic Ray-sensitive Or Radiation-sensitive Film, Pattern Forming Method, And Method For Producing Electronic Device
Abstract

The present invention provides an actinic ray-sensitive or radiation-sensitive resin composition including an acid-decomposable resin (A) and the following compound (B), an actinic ray-sensitive or radiation-sensitive resin film formed using the composition, and a pattern forming method and a method for producing an electronic device that use the composition, Compound (B): a compound that has structural moieties X and Y described in the specification and that generates an acid including a first acidic moiety derived from the structural moiety X and a second acidic moiety derived from the structural moiety Y upon irradiation with actinic rays or radiation, in which a compound PI obtained by replacing cationic moieties with H+ has acid dissociation constants a1 and a2 derived from the acidic moieties, a2 is larger than al, and an anionic moiety in the structural moiety Y is represented by a formula (1) described in the specification.

Full Text

What is claimed is:

The present invention provides an actinic ray-sensitive or radiation-sensitive resin composition including an acid-decomposable resin (A) and the following compound (B), an actinic ray-sensitive or radiation-sensitive resin film formed using the composition, and a pattern forming method and a method for producing an electronic device that use the composition, Compound (B): a compound that has structural moieties X and Y described in the specification and that generates an acid including a first acidic moiety derived from the structural moiety X and a second acidic moiety derived from the structural moiety Y upon irradiation with actinic rays or radiation, in which a compound PI obtained by replacing cationic moieties with H+ has acid dissociation constants a1 and a2 derived from the acidic moieties, a2 is larger than al, and an anionic moiety in the structural moiety Y is represented by a formula (1) described in the specification.
Timeline
Filed
03/05/2026
Published
07/09/2026
Granted
Not Available
IPC Codes(27)
G03F 7/004:Photosensitive materials (, take precedence G03F 7/12, G03F 7/14)
C07C 25/18:Polycyclic aromatic halogenated hydrocarbons
C07C 309/17:containing carboxyl groups bound to the carbon skeleton