A sensor packaging structure includes a housing, a substrate, a sensing component, and a waterproof membrane. The housing has an opening at one end, and the substrate covers the opening to form an encapsulation cavity with the housing. A first acoustic hole is formed in the substrate and communicates with the encapsulation cavity. The sensing component is accommodated in the encapsulation cavity and includes a mounting plate, a sensor chip, and a signal processing chip mounted side by side on the mounting plate, the sensor chip having a vibration cavity. A second acoustic hole is formed in the mounting plate to communicate the vibration cavity with the encapsulation cavity, and the second acoustic hole is offset from the first acoustic hole.