There is disclosed a method for forming grooves (10) in a board element (200). The method comprises arranging the board element in contact with a support member (120), and forming at least one groove (10) in a rear side (220) of the board element by removing material, such as chips, from the board element by a rotating cutting device (131) comprising a plurality of tooth elements configured to rotate around a rotational axis. The method further comprises counteracting, such as preventing, a displacement of the board element away from the support member during forming of the at least one groove, wherein the counteracting, such as preventing, comprises arranging at least a portion of the board element between an obstruction element (170) and the support member. The disclosure generally relates to methods and systems for forming groove(s) in a board element as well as to various panels comprising at least one groove.