A method for joining two electronic circuits with the aid a connection system includes the steps of a) mechanically processing a busbar of a first electronic circuit producing a bending point in the busbar, b) arranging the at least one mechanically processed busbar of the first electronic circuit to overlap with a busbar of a second electronic circuit, c) applying a uniformly distributed joining force to the busbars arranged to be overlapping one another, both in the region of the first electronic circuit and in the region of the second electronic circuit, d) pressing down on the busbars in the region of the bending point, e) deforming at least the busbar of the first electronic circuit in the region of the bending point, and f) producing a firm connection between the busbars of the at least two circuits.