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/Electronic Device Including Structure For Dissipating Heat
Abstract

An electronic device is provided. The electronic device includes a display, a first housing including a first supporting portion for supporting the display, a second housing including a second supporting portion for supporting the display, at least one electronic component disposed in the first housing, and a hinge structure configured to rotatably couple the first housing and the second housing, wherein the first supporting portion and the second supporting portion are configured to form a heat transfer path from the at least one electronic component to the second housing by being connected to each other in an unfolded state of the electronic device.

Full Text

What is claimed is:

An electronic device is provided. The electronic device includes a display, a first housing including a first supporting portion for supporting the display, a second housing including a second supporting portion for supporting the display, at least one electronic component disposed in the first housing, and a hinge structure configured to rotatably couple the first housing and the second housing, wherein the first supporting portion and the second supporting portion are configured to form a heat transfer path from the at least one electronic component to the second housing by being connected to each other in an unfolded state of the electronic device.
Timeline
Filed
03/13/2026
Published
07/16/2026
Granted
Not Available
IPC Codes(4)
G06F 1/16:Constructional details or arrangements
G06F 1/20:Cooling means
H04M 1/02:Constructional features of telephone sets