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/Pressure Sensitive Adhesive Composition
Abstract

The present invention refers to a pressure sensitive adhesive composition, the use of said composition in re-closable packaging units, an article comprising the pressure sensitive adhesive composition and a method for manufacturing said article.

Full Text

What is claimed is:

The present invention refers to a pressure sensitive adhesive composition, the use of said composition in re-closable packaging units, an article comprising the pressure sensitive adhesive composition and a method for manufacturing said article.
Timeline
Filed
03/13/2026
Published
07/16/2026
Granted
Not Available
IPC Codes(5)
C09J 123/18:Homopolymers or copolymers of hydrocarbons having four or more carbon atoms
C08K 5/00:Use of organic ingredients
C08K 5/378:containing heterocyclic rings