/Substrate Processing Apparatus, Method Of Processing Substrate, Method Of Manufacturing Semiconductor Device, And Recording Medium
Abstract
A technique that includes : a process chamber in which a substrate is processed with a gas; a plasma generator configured to convert the gas into a plasma state; a supply pipe installed at an upstream side of the process chamber; an exhaust pipe installed at a downstream side of the process chamber; a valve installed at a downstream side of the exhaust pipe; and an attenuator configured to attenuate an energy of the gas in the plasma state, the attenuator being installed at the exhaust pipe at a position closer to the valve than the process chamber, or installed at an upstream side of a connection between the supply pipe and the process chamber.
Full Text
What is claimed is:
A technique that includes : a process chamber in which a substrate is processed with a gas; a plasma generator configured to convert the gas into a plasma state; a supply pipe installed at an upstream side of the process chamber; an exhaust pipe installed at a downstream side of the process chamber; a valve installed at a downstream side of the exhaust pipe; and an attenuator configured to attenuate an energy of the gas in the plasma state, the attenuator being installed at the exhaust pipe at a position closer to the valve than the process chamber, or installed at an upstream side of a connection between the supply pipe and the process chamber.
Timeline
Filed
03/16/2026Published
07/16/2026Granted
Not AvailableIPC Codes(1)
H01J 37/32:Gas-filled discharge tubes (heating by discharge H05B)