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/Electronic Device And Method For Manufacturing Electronic Device
Abstract

An electronic device includes a first member with a first obverse surface, an electronic element on the first member, a connecting member connected to the electronic element, a second member with a second reverse surface, and a sealing resin covering the first member, the second member, the electronic element, and the connecting member. The second member includes a terminal portion and a connecting portion connected to the connecting member. The first obverse surface includes a first flat portion and a first projecting portion. The first projecting portion projects to the first side in the thickness direction relative to the first flat portion. The second reverse surface includes a second flat portion and a second projecting portion. The second projecting portion projects to the second side in the thickness direction relative to the second flat portion.

Full Text

What is claimed is:

An electronic device includes a first member with a first obverse surface, an electronic element on the first member, a connecting member connected to the electronic element, a second member with a second reverse surface, and a sealing resin covering the first member, the second member, the electronic element, and the connecting member. The second member includes a terminal portion and a connecting portion connected to the connecting member. The first obverse surface includes a first flat portion and a first projecting portion. The first projecting portion projects to the first side in the thickness direction relative to the first flat portion. The second reverse surface includes a second flat portion and a second projecting portion. The second projecting portion projects to the second side in the thickness direction relative to the second flat portion.
Timeline
Filed
03/12/2026
Published
07/16/2026
Granted
Not Available
IPC Codes(5)
H10W 70/40:Leadframes
H10W 70/04:of leadframes
H10W 72/50:Bond wires