A heat dissipation apparatus according to the present invention includes: a first-side heat-conducting panel provided as a metal panel member; and a second-side heat-conducting panel provided as a metal panel member, wherein the first-side heat-conducting panel and the second-side heat-conducting panel have bent edge portions that are surface-bonded to each other to define a refrigerant flow space in which a refrigerant flows while undergoing phase change, and wherein the bent edge portion of one of the first-side heat-conducting panel and the second-side heat-conducting panel is arranged such that at least a portion thereof overlaps in a thickness direction of the refrigerant flow space with the bent edge portion of the other so as to enable the mutual surface bonding, thereby providing the advantages of maximizing heat dissipation performance and preventing injury to workers during product manufacturing.