Abstract
A display apparatus includes: a display panel including a first pad and a second pad; an electronic chip package including a first bump arranged to overlap the first pad and a second bump arranged to overlap the second pad; a first conductive adhesive layer arranged between the first pad and the first bump and including a first resin and a first conductive ball; a second conductive adhesive layer arranged between the second pad and the second bump and including a second resin including the same material as the first resin and a second conductive ball including the same material as the first conductive ball; and an elastic layer arranged between the first bump and the second bump and including an elastomer.
Full Text
What is claimed is:
A display apparatus includes: a display panel including a first pad and a second pad; an electronic chip package including a first bump arranged to overlap the first pad and a second bump arranged to overlap the second pad; a first conductive adhesive layer arranged between the first pad and the first bump and including a first resin and a first conductive ball; a second conductive adhesive layer arranged between the second pad and the second bump and including a second resin including the same material as the first resin and a second conductive ball including the same material as the first conductive ball; and an elastic layer arranged between the first bump and the second bump and including an elastomer.
Timeline
Filed
03/19/2026Published
07/23/2026Granted
Not AvailableIPC Codes(5)
H10K 59/131:Interconnections, e.g. wiring lines or terminals
G09G 3/3233:with pixel circuitry controlling the current through the light-emitting element
H10K 59/12:Active-matrix OLED [AMOLED] displays