Abstract
A method and apparatus for depositing a material on a surface of a substrate are disclosed. The method can include a treatment step to suppress a rate of material deposition on the surface of the substrate. The method can result in higher-quality deposited material. Additionally or alternatively, the method can be used to fill a gap within the surface of the substrate with reduced or no seam formation.
Full Text
What is claimed is:
A method and apparatus for depositing a material on a surface of a substrate are disclosed. The method can include a treatment step to suppress a rate of material deposition on the surface of the substrate. The method can result in higher-quality deposited material. Additionally or alternatively, the method can be used to fill a gap within the surface of the substrate with reduced or no seam formation.
Timeline
Filed
03/19/2026Published
07/23/2026Granted
Not AvailableIPC Codes(2)
C23C 16/04:Coating on selected surface areas, e.g. using masks
C23C 16/455:characterised by the method used for introducing gases into the reaction chamber or for modifying gas flows in the reaction chamber