Abstract
Disclosed herein are microelectronic structures including bridges, as well as related assemblies and methods. In some embodiments, a microelectronic structure may include a substrate and a bridge.
Full Text
What is claimed is:
Disclosed herein are microelectronic structures including bridges, as well as related assemblies and methods. In some embodiments, a microelectronic structure may include a substrate and a bridge.
Timeline
Filed
03/26/2026Published
07/30/2026Granted
Not AvailableIPC Codes(9)
H10W 74/10:characterised by their shape or disposition
H10W 70/60:Insulating or insulated package substrates; Interposers; Redistribution layers (leadframes H10W 70/40)
H10W 70/685:comprising multiple insulating layers