/Optical Device, Optical System, Method For Machining A Sample By Means Of Laser Radiation, And Sample
Abstract

An optical device for machining a sample via laser radiation in at least two machining steps. The device comprises at least one beam splitter, a first optical machining device, and a second optical machining device. The beam splitter is arranged such that a laser beam can be split into at least two partial beams. The partial beams can be oriented towards the sample such that the sample is machined in two machining steps. The optical device comprises a component for changing the power density, so that the power density of the first partial beam is greater than the power density of the second partial beam. The invention also relates to an optical system comprising the optical device, to a method for machining the sample, and to a sample machined via the optical device.

Full Text

What is claimed is:

An optical device for machining a sample via laser radiation in at least two machining steps. The device comprises at least one beam splitter, a first optical machining device, and a second optical machining device. The beam splitter is arranged such that a laser beam can be split into at least two partial beams. The partial beams can be oriented towards the sample such that the sample is machined in two machining steps. The optical device comprises a component for changing the power density, so that the power density of the first partial beam is greater than the power density of the second partial beam. The invention also relates to an optical system comprising the optical device, to a method for machining the sample, and to a sample machined via the optical device.
Timeline
Filed
04/06/2026
Published
07/30/2026
Granted
Not Available
IPC Codes(3)
B23K 26/067:Dividing the beam into multiple beams, e.g. multi-focusing
B23K 26/06:Shaping the laser beam, e.g. by masks or multi-focusing
B23K 26/062:by direct control of the laser beam