/Method For Producing An Optical System For A Lithography Apparatus, Substrate For An Optical Component Of A Lithography Apparatus, And Lithography Apparatus
Abstract

Optical system production method includes (a) providing (S2) a distribution function (g) for a zero-crossing temperature (ZCTR) of a coefficient of thermal expansion (αR) of the raw block as a function of a location (p) of the raw block, (b) ascertaining (S3), an aberration (Fi) of the optical system, for the provided distribution function and each of a plurality of positions (Pi) of a cutout region (D) of the raw block that differ from one another with respect a radial position (ri) and/or a height position (hi) of the raw block, and (c) ascertaining (S4) at least one selection position (Pa) of the cutout region (D) as the position (Pi) for which the ascertained aberration (Fi) is less than a predetermined threshold value (SW).

Full Text

What is claimed is:

Optical system production method includes (a) providing (S2) a distribution function (g) for a zero-crossing temperature (ZCTR) of a coefficient of thermal expansion (αR) of the raw block as a function of a location (p) of the raw block, (b) ascertaining (S3), an aberration (Fi) of the optical system, for the provided distribution function and each of a plurality of positions (Pi) of a cutout region (D) of the raw block that differ from one another with respect a radial position (ri) and/or a height position (hi) of the raw block, and (c) ascertaining (S4) at least one selection position (Pa) of the cutout region (D) as the position (Pi) for which the ascertained aberration (Fi) is less than a predetermined threshold value (SW).
Timeline
Filed
03/26/2026
Published
07/30/2026
Granted
Not Available
IPC Codes(4)
B28D 7/00:Accessories specially adapted for use with machines or devices of the other groups of this subclass
B28D 1/22:by cutting, e.g. incising
G02B 5/08:Mirrors