A wafer placement table includes: a ceramic plate incorporating an electrode; a base plate having a refrigerant flow path therein; a stepped hole penetrating the base plate in an up-down direction and having an upper hole portion, a lower hole portion, and a hole step portion; an insulating tube inserted into the upper hole portion; a resin tube inserted into the lower hole portion, having an upper surface bonded to the hole step portion, and having a larger diameter than the insulating tube; and a power feeding member having an upper surface connected to the electrode and inserted into the insulating tube and the resin tube. On the upper surface of the resin tube, a convex member for securing a gap between the upper surface of the resin tube and the hole step portion of the stepped hole is provided, and the adhesive layer is filled in the gap.