Abstract
Provided is a substrate support assembly. A base of the substrate support assembly includes a flow path. The first container is configured to change a first capacity therein such that the heat transfer medium is supplied to the flow path via the at least one first pipe by a decrease in the first capacity. A second container is configured to change a second capacity therein such that a gas is supplied to the flow path by a decrease in the second capacity. The first container and the second container are configured such that a decrease in one of the first capacity and the second capacity causes an increase in the other. The heat transfer medium supply further includes at least one third pipe and a valve.
Full Text
What is claimed is:
Provided is a substrate support assembly. A base of the substrate support assembly includes a flow path. The first container is configured to change a first capacity therein such that the heat transfer medium is supplied to the flow path via the at least one first pipe by a decrease in the first capacity. A second container is configured to change a second capacity therein such that a gas is supplied to the flow path by a decrease in the second capacity. The first container and the second container are configured such that a decrease in one of the first capacity and the second capacity causes an increase in the other. The heat transfer medium supply further includes at least one third pipe and a valve.
Timeline
Filed
03/26/2026Published
07/30/2026Granted
Not AvailableIPC Codes(3)
H10P 72/76:using mechanical means, e.g. clamps or pinches
H01J 37/32:Gas-filled discharge tubes (heating by discharge H05B)
H10P 72/00:Handling or holding of wafers, substrates or devices during manufacture or treatment thereof