A processing and switching die, a communication chip, a data processing apparatus, and a method are disclosed, and relate to the field of communication technologies, to greatly reduce a quantity of processing units in a device, reduce device costs, improve device energy efficiency, and reduce heat dissipation and power supply costs and deployment space. A communication chip is provided. The communication chip includes a processing and switching die and a plurality of network processing dies coupled to the processing and switching die. The processing and switching die includes at least one processing unit and a plurality of switching units. The at least one processing unit is configured to: control and manage the plurality of switching units and the plurality of network processing dies. The plurality of network processing dies are configured to provide capabilities such as a network interface and network processing.