/Method For Producing Electronic Component And Method For Producing Mount Structure
Abstract

An electronic component includes a body, an inner electrode within the body, and an outer electrode outside of the body, wherein the outer electrode includes an outermost layer that includes metal particles but is not electrically connected to the inner electrode.

Full Text

What is claimed is:

An electronic component includes a body, an inner electrode within the body, and an outer electrode outside of the body, wherein the outer electrode includes an outermost layer that includes metal particles but is not electrically connected to the inner electrode.
Timeline
Filed
03/31/2026
Published
08/06/2026
Granted
Not Available
IPC Codes(4)
H01G 4/232:electrically connecting two or more layers of a stacked or rolled capacitor
H01G 4/12:Ceramic dielectrics
H01G 4/30:Stacked capacitors (takes precedence H01G 4/33)