/Substrate Processing Apparatus And Substrate Processing Method
Abstract

A substrate processing apparatus incudes: a processing module for processing substrates placed on stages; a first transfer module including a first transfer robot for collectively transferring the substrates with respect to the processing module; a second transfer module including a second transfer robot for transferring the substrates with respect to a container; and a load lock module provided between the first and second transfer modules to accommodate the substrates transferred by the first or second transfer robot. The load lock module includes: stage regions arranged around a center of a rotary support; the rotary support including fixed support pins for supporting the substrates; and a drive mechanism for driving the rotary support in a rotational direction. When transferring the substrates between the load lock module and the first or second transfer module, the first or second transfer robot transfers the substrates with respect to the fixed support pins.

Full Text

What is claimed is:

A substrate processing apparatus incudes: a processing module for processing substrates placed on stages; a first transfer module including a first transfer robot for collectively transferring the substrates with respect to the processing module; a second transfer module including a second transfer robot for transferring the substrates with respect to a container; and a load lock module provided between the first and second transfer modules to accommodate the substrates transferred by the first or second transfer robot. The load lock module includes: stage regions arranged around a center of a rotary support; the rotary support including fixed support pins for supporting the substrates; and a drive mechanism for driving the rotary support in a rotational direction. When transferring the substrates between the load lock module and the first or second transfer module, the first or second transfer robot transfers the substrates with respect to the fixed support pins.
Timeline
Filed
04/15/2026
Published
08/06/2026
Granted
Not Available
IPC Codes(2)
H10P 72/30:for conveying, e.g. between different workstations
H10P 72/00:Handling or holding of wafers, substrates or devices during manufacture or treatment thereof