A capacitor is disposed on an upper surface, which is one surface of a support substrate. A first insulating film covering the capacitor is disposed on the support substrate. A second insulating film is disposed on the first insulating film. A multilayer wiring layer including multiple wiring layers and multiple third insulating films, stacked in an alternating manner, is disposed on the second insulating film. The multilayer wiring layer includes an inductor constituted by conductor patterns in wiring layers. The weight-average molecular weight of the resin forming the second insulating film is greater than the weight-average molecular weight of the resin forming the third insulating film.