A micro-display chip structure includes: a driving circuit substrate; a plurality of light-emitting units disposed on the driving circuit substrate and spaced apart from each other; a color conversion layer disposed on the plurality of light-emitting units, the color conversion layer at least including first wavelength conversion units; a supporting frame including a plurality of supporting units, each supporting unit of the plurality of supporting units being disposed corresponding to each light-emitting unit of the plurality of light-emitting units, and the supporting unit at least covering a sidewall of the light-emitting unit; and a first reflective layer, at least covering a sidewall of the supporting unit. Embodiments of the present disclosure may simplify a preparation process of the micro-display chip structure and reduce a risk of damage to the light-emitting unit caused by partial etching processes during the preparation process of the micro-display chip structure.
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What is claimed is: