A composition including a hydrophobic compound (A) formed from a hydrophobic compound (A1) and a hydrophobic compound (A2) different from the hydrophobic compound (A1), where the endothermic peak of the hydrophobic compound (A1) in differential scanning calorimetry is shifted by 0.5° C. to 80° C. to the lower temperature side in differential scanning calorimetry of the hydrophobic compound (A), and the composition can impart liquid repellency to a base material.