A method of manufacturing a semiconductor package, comprising includes forming support structures having a predetermined height in a vertical direction from an upper surface of a package substrate, stacking a plurality of semiconductor chips in a stair-step configuration up to a height equal to the predetermined height of the support structures, stacking an uppermost semiconductor chip on the support structures and the semiconductor chips, and connecting a conductive wire on the uppermost semiconductor chip, forming the support structures includes extending a conductive material drawn from a capillary to have a predetermined length equal to the predetermined height from the package substrate to contact a contact pad, forming a scratched portion in the conductive material in a state in which the conductive material is not attached to another contact pad, and erecting the conductive material by moving the capillary in the vertical direction and cutting the scratched portion of the conductive material.