/Semiconductor Device Structure
Abstract

A semiconductor device structure is provided. The semiconductor device structure includes a substrate having a base. The semiconductor device structure includes a first multilayer stack over the base. The first multilayer stack includes a first channel layer and a second channel layer over and spaced apart from the first channel layer. The semiconductor device structure includes a gate stack over the substrate. The gate stack wraps around the first multilayer stack. The semiconductor device structure includes an insulating feature over the base. A bottom part of the insulating feature extends into the base. The semiconductor device structure includes a first source/drain structure over the insulating feature and connected to the second channel layer. The insulating feature separates the first source/drain structure from the base.

Full Text

What is claimed is:

A semiconductor device structure is provided. The semiconductor device structure includes a substrate having a base. The semiconductor device structure includes a first multilayer stack over the base. The first multilayer stack includes a first channel layer and a second channel layer over and spaced apart from the first channel layer. The semiconductor device structure includes a gate stack over the substrate. The gate stack wraps around the first multilayer stack. The semiconductor device structure includes an insulating feature over the base. A bottom part of the insulating feature extends into the base. The semiconductor device structure includes a first source/drain structure over the insulating feature and connected to the second channel layer. The insulating feature separates the first source/drain structure from the base.
Timeline
Filed
04/13/2026
Published
08/13/2026
Granted
Not Available
IPC Codes(9)
H10D 84/03:using Group IV technology, e.g. silicon technology or silicon-carbide [SiC] technology
H10D 30/01:Manufacture or treatment
H10D 30/67:Thin-film transistors [TFT]