Abstract
The present disclosure provides an adjustment method for an imprint apparatus that forms a pattern to an imprint material on a substrate held by a stage, by using a mold held by a mold holder, the method comprising: estimating a position of a member held by the mold holder, as a first position, based on a result of detecting a relative position between a mark on the member and a mark on the stage with a detector; estimating a position of the member, as a second position, based on a result of measuring a surface height distribution of the member held by the mold holder with a measurement device; and determining an offset of the measurement device based on the estimated first and second positions.
Full Text
What is claimed is:
The present disclosure provides an adjustment method for an imprint apparatus that forms a pattern to an imprint material on a substrate held by a stage, by using a mold held by a mold holder, the method comprising: estimating a position of a member held by the mold holder, as a first position, based on a result of detecting a relative position between a mark on the member and a mark on the stage with a detector; estimating a position of the member, as a second position, based on a result of measuring a surface height distribution of the member held by the mold holder with a measurement device; and determining an offset of the measurement device based on the estimated first and second positions.
Timeline
Filed
04/13/2026Published
08/13/2026Granted
Not AvailableIPC Codes(5)
B29C 43/58:Measuring, controlling or regulating
B29C 43/18:incorporating preformed parts or layers, e.g. compression moulding around inserts or for coating articles
G01B 11/06:for measuring thickness