A tape applicator apparatus is disclosed. The apparatus may include a tape cutter mechanism including a hot wire assembly configured to cut tape. The apparatus may include a puller mechanism with a puller frame and a grabber coupled to the puller frame. A grab actuator may be coupled to the grabber and configured to activate a grab operation of the grabber, where the grab operation is configured to grab the tape. A reach actuator may be coupled to the puller frame and the grabber and configured to extend the grabber towards the tape at the tape cutter mechanism and retract the grabber and the tape. A package may be configured to be received between the tape cutter mechanism and the puller mechanism such that the package lands on the tape and falls between the tape cutter mechanism and the puller mechanism.