/Image Display Device Manufacturing Method And Image Display Device
Abstract

An image display device includes: a light-transmitting member including a first surface; a light-emitting element located on the first surface of the light-transmitting member and including a light-emitting surface and an upper surface on a side opposite to the light-emitting surface; a light-blocking electrode covering the upper surface of the light-emitting element and electrically connected to the upper surface; a first insulating film covering the first surface of the light-transmitting member, the light-emitting element, and the light-blocking electrode; a circuit element located on the first insulating film; a second insulating film covering the first insulating film and the circuit element; a first via passing through the first insulating film and the second insulating film; and a first wiring layer located on the second insulating film. The first via is located between and electrically connects the first wiring layer and the light-blocking electrode.

Full Text

What is claimed is:

An image display device includes: a light-transmitting member including a first surface; a light-emitting element located on the first surface of the light-transmitting member and including a light-emitting surface and an upper surface on a side opposite to the light-emitting surface; a light-blocking electrode covering the upper surface of the light-emitting element and electrically connected to the upper surface; a first insulating film covering the first surface of the light-transmitting member, the light-emitting element, and the light-blocking electrode; a circuit element located on the first insulating film; a second insulating film covering the first insulating film and the circuit element; a first via passing through the first insulating film and the second insulating film; and a first wiring layer located on the second insulating film. The first via is located between and electrically connects the first wiring layer and the light-blocking electrode.
Timeline
Filed
04/13/2026
Published
08/13/2026
Granted
Not Available
IPC Codes(6)
H10H 20/857:Interconnections, e.g. lead-frames, bond wires or solder balls
H10H 20/01:Manufacture or treatment
H10H 20/825:containing nitrogen, e.g. GaN