Abstract
Described herein are a component carrier, wherein the component carrier comprises: a stack comprising a plurality of electrically conductive layer structures and at least one electrically insulating layer structure, wherein at least two of said electrically conductive layer structures are connected through a plurality of (electrical) conductive nanowires.
Full Text
What is claimed is:
Described herein are a component carrier, wherein the component carrier comprises: a stack comprising a plurality of electrically conductive layer structures and at least one electrically insulating layer structure, wherein at least two of said electrically conductive layer structures are connected through a plurality of (electrical) conductive nanowires.
Timeline
Filed
04/22/2026Published
08/13/2026Granted
Not AvailableIPC Codes(2)
H05K 1/11:Printed elements for providing electric connections to or between printed circuits
H05K 3/46:Manufacturing multi-layer circuits