An optical module includes a circuit board and a light-emitting component, the circuit board includes a plurality of board layers, a plurality of medium layers and a blind hole in a thickness direction. A filing member is disposed in the blind hole; the light-emitting component includes a light-emitting housing, a light-emitting assembly, a light-emitting driving chip and a heat conduction column; wherein a position of the blind hole corresponds to a position of the light-emitting driving chip; and during transfer of heat generated by the light-emitting driving chip to the circuit board, the heat can be conducted, via the filling member in the blind hole and the heat conduction column, to the shell for heat dissipation.