Abstract
A bump preparation apparatus includes a bump preparation mechanism and a compacting mechanism that are sequentially arranged along a conveying direction of a first material, where the bump preparation mechanism is configured to prepare overpressed bumps on the first material, a height of each overpressed bump is greater than a height of a preset bump, the preset bump is a bump required by the first material, and the compacting mechanism is configured to apply a pressure to the overpressed bumps toward a main body portion of the first material, such that a thickness of the first material reaches a preset value.
Full Text
What is claimed is:
A bump preparation apparatus includes a bump preparation mechanism and a compacting mechanism that are sequentially arranged along a conveying direction of a first material, where the bump preparation mechanism is configured to prepare overpressed bumps on the first material, a height of each overpressed bump is greater than a height of a preset bump, the preset bump is a bump required by the first material, and the compacting mechanism is configured to apply a pressure to the overpressed bumps toward a main body portion of the first material, such that a thickness of the first material reaches a preset value.
Timeline
Filed
04/14/2026Published
08/20/2026Granted
Not AvailableIPC Codes(3)
B21D 22/04:for dimpling (combined with perforating B21D 28/24)
H01M 4/04:Processes of manufacture in general
H01M 10/04:Construction or manufacture in general (, take precedence H01M 10/058, H01M 10/12, H01M 10/28, H01M 10/38)